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dc.contributor.authorFakhr O
dc.contributor.authorKarrai K
dc.contributor.authorLugli P
dc.contributor.editor
dc.date.accessioned2018-08-28T07:35:03Z
dc.date.available2018-08-28T07:35:03Z
dc.date.issued2012
dc.identifier.issn0040-6090
dc.identifier.urihttp://dx.doi.org/10.1016/j.tsf.2011.11.006
dc.identifier.urihttp://www.sciencedirect.com/science/article/pii/S0040609011019742
dc.identifier.urihttp://hdl.handle.net/10863/5903
dc.description.abstractWe were able to reduce the processing steps of transfer printing of thin gold films through prolonged evaporation times. We suspect the reduced evaporation rate to cause diffusion of small chain molecules (oligomers) in the PDMS (poly(dimethylsiloxane)) stamp to facilitate the transfer. Typical wrinkling of the PDMS surface was avoided by fabricating thin stamps of approximately 50 μm with polymer backing. The transferred films with a thickness of 20 nm showed enhanced edge resolution and a roughness of 1.31 nm root mean square. We were further able to fabricate 3D structures, indicating stability of the transferred films. Adhesion problems remain a limitation for contacting purposes. © 2011 Elsevier B.V. All rights reserved.en_US
dc.language.isoenen_US
dc.rights
dc.subjectNanopatterningen_US
dc.subjectSoft lithographyen_US
dc.subjectPoly(dimethylsilozane)en_US
dc.subjectGolden_US
dc.subjectElectrodesen_US
dc.titleDirect transfer patterning of gold films with minimal processing stepsen_US
dc.typeArticleen_US
dc.date.updated2018-08-28T07:25:52Z
dc.publication.title
dc.language.isiEN-GB
dc.journal.titleThin Solid Films : international journal on the science and technology of condensed matter films
dc.description.fulltextreserveden_US


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