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dc.contributor.authorColasanti S
dc.contributor.authorBhatt V
dc.contributor.authorLugli P
dc.contributor.editor
dc.date.accessioned2017-11-13T14:49:52Z
dc.date.available2017-11-13T14:49:52Z
dc.date.issued2014
dc.identifier.isbn978-1-4799-4993-9
dc.identifier.urihttp://dx.doi.org/10.1109/PRIME.2014.6872679
dc.identifier.urihttp://ieeexplore.ieee.org/document/6872679/
dc.identifier.urihttp://hdl.handle.net/10863/3753
dc.description.abstractA novel numerical 3D-model for simulations of random networks of carbon nanotubes is presented. This new algorithm takes into account the real 3D nature of these networks, allowing a better understanding of their electrical properties. CNTs are modeled as stiff cylinder with geometrical properties derived accordingly to different distributions. In this model CNT are allowed to bend in order to adapt in a realistic fashion to the surrounding environment. The electrical behavior of the network is simulated with a SPICE program. A temperature analysis has been performed, showing a good match between the simulations and the experiments. The present approach constitutes the basic building block for the simulation of a variety of sensors on rigid and flexible substrates.en_US
dc.language.isoenen_US
dc.publisherInstitute of Electrical and Electronics Engineers Inc.en_US
dc.rights
dc.subjectSPICEen_US
dc.subjectSensorsen_US
dc.subjectCNT networksen_US
dc.subjectCarbon nanotubes (CNT)en_US
dc.subject3D-modelingen_US
dc.title3D modeling of CNT networks for sensing applicationsen_US
dc.typeBook chapteren_US
dc.date.updated2017-07-10T13:16:45Z
dc.publication.title2014 10th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME 2014): Grenoble, France, 30 June - 3 July 2014
dc.language.isiEN-GB
dc.description.fulltextnoneen_US


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