Abstract
Transferable temperature sensors that maintain reliable performance across heterogeneous interfaces are increasingly important for next-generation soft and unconventional electronics. However, conventional transfer methods based on sacrificial-layer dissolution limit material compatibility and device reliability, particularly on non-planar and environmentally dynamic surfaces. Here, a wetting-driven transfer strategy is presented for resistive temperature detectors (RTDs) and thermistors based on zinc (Zn), copper (Cu), and amorphous indium gallium zinc oxide (IGZO). The wetting-controlled delamination enables a clean release from a superhydrophilic donor substrate without the need for sacrificial layers or etching steps, avoiding complex release procedures. A conformal Parylene carrier layer preserves the integrity of water-sensitive materials while providing mechanical support, thus enabling transfer from a super-hydrophilic donor substrate onto biological receiver substrates, including leaves and gastropod shells. The transferred devices exhibit stable resistance-temperature behavior with minimal variation after transfer, demonstrating reliable operation across flat, curved, and irregular surfaces. In addition, the sensors operate in floating-on-water configurations, highlighting the mechanical compliance and robustness of the ultrathin structures. Overall, this work establishes a scalable, material-compatible platform for integrating flexible temperature sensors onto unconventional surfaces, thereby expanding the applicability of soft electronics to dynamic and environmentally diverse systems.