Abstract
Electronic devices, such as wearable electronics, edible electronics, smart packaging, biosensors, and bioimplants, are becoming indispensable parts of daily life. Conventional methods for fabricating electronic devices apply hazardous, non-ecofriendly, and non-biodegradable materials. Electronic devices that have reached the end of life are converted into electronic waste (e-waste), considerably impacting the environment at risk. The hazardous elements found in e-waste, such as arsenic (As), mercury (Hg), and lead (Pb), endanger human life by contaminating the air, water, and soil. The United Nations established seventeen goals for sustainable development and 169 targets in the 2030 Agenda for Sustainable Development to make our planet safer and more sustainable for future generations by tackling several challenges, including e-waste. Among the sustainable development goals, good health and well-being (Goals 3), clean water and sanitation (6), decent work and economic growth (8), sustainable cities and communities (11), responsible consumption and production (12), and life below water (14) are intricately connected in addressing the adverse effects of e-waste. In agreement with the European Union and United Nations Green Deal guidelines, the field of electronics has to focus on strategies and approaches for the circular economy, methods for sustainability, and plans toward a zero-pollution environment. These initiatives are significant in mitigating the escalating generation of e-waste, decreasing reliance on critical raw materials such as rare-earth elements, and improving the currently low recycling rate. Bearing the urgency for improved recycling infrastructures and sustainable practices within the electronics industry, I have presented the fabrication of thin-film electronic devices with the least environmental impact. I first implemented temperature sensors using sustainable materials, demonstrating their solubility once they reach end-of-life. Next, I employed thermistors to assess electrical performance on the same substrate by deposiing an indium-gallium-zinc-oxide (IGZO) layer on top of the green metals. I then realize and characterize thin-film transistors (TFTs), followed by comprehensive evaluations of their electrical, mechanical, and overall performance. I perform reliability tests to gauge the stability of these TFTs under different conditions on a polyether-ether ketone (PEEK) substrate. In the final stage, I fabricated green gate metal-based TFTs and thoroughly analyzed their transfer and output characteristics.