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Natural Wood Substrates for Flexible Thin-Film Temperature Sensors
Conference proceeding   Peer reviewed

Natural Wood Substrates for Flexible Thin-Film Temperature Sensors

2025 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)
2025 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) (Singapore, 15/06/2025–18/06/2025)
2025
Handle:
https://hdl.handle.net/10863/50148

Abstract

url
https://ieeexplore.ieee.org/document/11105635View

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